HN482732AG-25 vs M2732AF6 feature comparison

HN482732AG-25 Renesas Electronics Corporation

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M2732AF6 STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP STMICROELECTRONICS
Part Package Code DIP DIP
Package Description DIP, WINDOWED, FRIT SEALED, CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
JESD-30 Code R-PDIP-T24 R-GDIP-T24
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4KX8 4KX8
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Supply Current-Max 0.035 mA 0.125 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS NMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 1 1
Rohs Code No
Additional Feature 21V PROGRAMMING VOLTAGE
I/O Type COMMON
JESD-609 Code e0
Length 31.75 mm
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.6
Programming Voltage 21 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm
Terminal Finish TIN LEAD
Terminal Pitch 2.54 mm
Width 15.24 mm

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Compare M2732AF6 with alternatives