Findchips: Compare HN27C512G-17 vs AM27C512-170/BXA

HN27C512G-17 vs AM27C512-170/BXA feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	RENESAS TECHNOLOGY CORP	ROCHESTER ELECTRONICS LLC
Part Package Code	DIP
Package Description	WDIP,	DIP,
Pin Count	28
Reach Compliance Code	unknown	unknown
ECCN Code	EAR99	3A001.A.2.C
HTS Code	8542.32.00.61	8542.32.00.61
Access Time-Max	170 ns	170 ns
JESD-30 Code	R-GDIP-T28	R-GDIP-T28
Length	36.83 mm	37.1475 mm
Memory Density	524288 bit	524288 bit
Memory IC Type	UVPROM	UVPROM
Memory Width	8	8
Number of Functions	1	1
Number of Terminals	28	28
Number of Words	65536 words	65536 words
Number of Words Code	64000	64000
Operating Mode	ASYNCHRONOUS	ASYNCHRONOUS
Operating Temperature-Max	70 °C	125 °C
Operating Temperature-Min		-55 °C
Organization	64KX8	64KX8
Package Body Material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
Package Code	WDIP	DIP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	IN-LINE, WINDOW	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Qualification Status	Not Qualified
Seated Height-Max	5.89 mm	5.588 mm
Supply Voltage-Max (Vsup)	5.5 V	5.5 V
Supply Voltage-Min (Vsup)	4.5 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	NO	NO
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	MILITARY
Terminal Form	THROUGH-HOLE	THROUGH-HOLE
Terminal Pitch	2.54 mm	2.54 mm
Terminal Position	DUAL	DUAL
Width	15.24 mm	15.24 mm
Base Number Matches	2	2
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Supply Current-Max		0.04 mA
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Memory » EPROMs	Memory » EPROMs