HN27C301G-20
vs
AM27C010-200DEB
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
HITACHI LTD
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
WDIP,
Pin Count
32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
200 ns
JESD-30 Code
R-GDIP-T32
Length
41.91 mm
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.8 mm
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Base Number Matches
2
4
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