HN27C256G-20 vs SMJ27C256-20JM feature comparison

HN27C256G-20 Renesas Electronics Corporation

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SMJ27C256-20JM Micross Components

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Obsolete Obsolete
RENESAS TECHNOLOGY CORP AUSTIN SEMICONDUCTOR INC
DIP DIP
WDIP, WDIP,
28 28
unknown unknown
EAR99 3A001.A.2.C
8542.32.00.61 8542.32.00.61
200 ns 200 ns
R-GDIP-T28 R-CDIP-T28
36.83 mm
262144 bit 262144 bit
UVPROM UVPROM
8 8
1 1
28 28
32768 words 32768 words
32000 32000
ASYNCHRONOUS ASYNCHRONOUS
70 °C 125 °C
-55 °C
32KX8 32KX8
CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
WDIP WDIP
RECTANGULAR RECTANGULAR
IN-LINE, WINDOW IN-LINE, WINDOW
PARALLEL PARALLEL
Not Qualified Not Qualified
5.89 mm 5.8928 mm
0.03 mA 0.025 mA
5.25 V 5.5 V
4.75 V 4.5 V
5 V 5 V
NO NO
CMOS CMOS
COMMERCIAL MILITARY
THROUGH-HOLE THROUGH-HOLE
2.54 mm 2.54 mm
DUAL DUAL
15.24 mm 15.24 mm
2 2
MIL-STD-883

Compare HN27C256G-20 with alternatives

Compare SMJ27C256-20JM with alternatives