HN27C256AP-15
vs
M27C256B-20XB3
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, LEAD FREE, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
150 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Length
35.6 mm
36.83 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.7 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.25 V
Supply Voltage-Min (Vsup)
4.5 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
AUTOMOTIVE
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
1
Rohs Code
I/O Type
COMMON
JESD-609 Code
e3
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Programming Voltage
12.75 V
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Terminal Finish
MATTE TIN
Compare HN27C256AP-15 with alternatives
Compare M27C256B-20XB3 with alternatives