HMU16GC-35 vs LMU16GC35 feature comparison

HMU16GC-35 Intersil Corporation

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LMU16GC35 LOGIC Devices Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTERSIL CORP LOGIC DEVICES INC
Part Package Code PGA PGA
Package Description CERAMIC, PGA-68 PGA, PGA68,11X11
Pin Count 68 68
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 2 X 16 BIT DATA INPUT BUS; MULTIPLEXED OUTPUT; ICC SPECIFIED AT 1MHZ
Boundary Scan NO NO
External Data Bus Width 16 16
JESD-30 Code S-CPGA-P68 S-CPGA-P68
JESD-609 Code e0 e0
Length 29.465 mm 29.4386 mm
Low Power Mode YES NO
Number of Terminals 68 68
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Output Data Bus Width 32 32
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code PGA PGA
Package Equivalence Code PGA68,11X11 PGA68,11X11
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.2 mm 3.81 mm
Supply Voltage-Max 5.25 V 5.25 V
Supply Voltage-Min 4.75 V 4.75 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form PIN/PEG PIN/PEG
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position PERPENDICULAR PERPENDICULAR
Width 29.465 mm 29.4386 mm
uPs/uCs/Peripheral ICs Type DSP PERIPHERAL, MULTIPLIER DSP PERIPHERAL, MULTIPLIER
Base Number Matches 1 1
ECCN Code 3A991.A.2
Clock Frequency-Max 28.57 MHz
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 225
Supply Current-Max 25 mA

Compare HMU16GC-35 with alternatives

Compare LMU16GC35 with alternatives