HMT112S6AFP6C-G8
vs
HMT112S6AFR6C-H9
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SK HYNIX INC
|
SK HYNIX INC
|
| Part Package Code |
DMA
|
DMA
|
| Package Description |
DIMM, DIMM204,24
|
DIMM, DIMM204,24
|
| Pin Count |
204
|
204
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.32
|
| Access Mode |
DUAL BANK PAGE BURST
|
DUAL BANK PAGE BURST
|
| Access Time-Max |
20 ns
|
20 ns
|
| Additional Feature |
AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
|
AUTO/SELF REFRESH; SEATED HGT-NOM; WD-MAX
|
| Clock Frequency-Max (fCLK) |
533 MHz
|
667 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-XDMA-N240
|
R-XDMA-N240
|
| Length |
67.6 mm
|
67.6 mm
|
| Memory Density |
1073741824 bit
|
1073741824 bit
|
| Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
203
|
203
|
| Number of Words |
134217728 words
|
134217728 words
|
| Number of Words Code |
128000000
|
128000000
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
128MX8
|
128MX8
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM204,24
|
DIMM204,24
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Seated Height-Max |
30 mm
|
30 mm
|
| Self Refresh |
YES
|
YES
|
| Standby Current-Max |
0.08 A
|
0.08 A
|
| Supply Current-Max |
1.66 mA
|
2.02 mA
|
| Supply Voltage-Max (Vsup) |
1.575 V
|
1.575 V
|
| Supply Voltage-Min (Vsup) |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
1.5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.6 mm
|
0.6 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
| Width |
3.8 mm
|
3.8 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare HMT112S6AFP6C-G8 with alternatives
Compare HMT112S6AFR6C-H9 with alternatives