HMS30C7202
vs
XPC850SRZT80BU
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Contact Manufacturer
|
Transferred
|
| Ihs Manufacturer |
MAGNACHIP SEMICONDUCTOR LTD
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
|
| Package Description |
17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, FBGA-256
|
PLASTIC, BGA-256
|
| Pin Count |
256
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
25
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| Format |
FIXED POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
| Length |
17 mm
|
23 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
2.35 mm
|
| Speed |
82.944 MHz
|
80 MHz
|
| Supply Voltage-Max |
2.7 V
|
3.465 V
|
| Supply Voltage-Min |
2.3 V
|
3.135 V
|
| Supply Voltage-Nom |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
17 mm
|
23 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
4
|
| ECCN Code |
|
3A991.A.2
|
| Clock Frequency-Max |
|
40 MHz
|
| Package Equivalence Code |
|
BGA256,16X16,50
|
|
|
|
Compare HMS30C7202 with alternatives