HMPP-389T-BLK
vs
HMPP-389T-TR1
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
BROADCOM LTD
|
AVAGO TECHNOLOGIES INC
|
| Package Description |
R-CBCC-N4
|
R-CBCC-N4
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.10.00.80
|
8541.10.00.80
|
| Application |
SWITCHING
|
SWITCHING
|
| Breakdown Voltage-Min |
100 V
|
100 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance-Max |
0.3 pF
|
0.3 pF
|
| Diode Capacitance-Nom |
0.2 pF
|
0.2 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Forward Resistance-Max |
2.5 Ω
|
2.5 Ω
|
| Diode Res Test Current |
1 mA
|
1 mA
|
| Diode Res Test Frequency |
100 MHz
|
100 MHz
|
| Diode Type |
PIN DIODE
|
PIN DIODE
|
| Frequency Band |
ULTRA HIGH FREQUENCY
|
ULTRA HIGH FREQUENCY
|
| JESD-30 Code |
R-CBCC-N4
|
R-CBCC-N4
|
| JESD-609 Code |
e3
|
e3
|
| Minority Carrier Lifetime-Nom |
0.2 µs
|
0.2 µs
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
4
|
4
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Reverse Test Voltage |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
POSITIVE-INTRINSIC-NEGATIVE
|
POSITIVE-INTRINSIC-NEGATIVE
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
20
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Pin Count |
|
4
|
| Samacsys Manufacturer |
|
Avago Technologies
|
|
|
|
Compare HMPP-389T-BLK with alternatives
Compare HMPP-389T-TR1 with alternatives