HMP125S6NFR8C-S5
vs
M470T5663FB3-CF7
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
SK HYNIX INC
|
SAMSUNG SEMICONDUCTOR INC
|
Part Package Code |
MODULE
|
MODULE
|
Package Description |
DIMM, DIMM200,24
|
DIMM, DIMM200,24
|
Pin Count |
200
|
200
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.36
|
8542.32.00.36
|
Access Mode |
DUAL BANK PAGE BURST
|
DUAL BANK PAGE BURST
|
Access Time-Max |
0.4 ns
|
0.4 ns
|
Additional Feature |
AUTO/SELF REFRESH
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK) |
400 MHz
|
400 MHz
|
I/O Type |
COMMON
|
COMMON
|
JESD-30 Code |
R-XDMA-N200
|
R-XDMA-N200
|
JESD-609 Code |
e1
|
|
Length |
67.6 mm
|
67.6 mm
|
Memory Density |
17179869184 bit
|
17179869184 bit
|
Memory IC Type |
DDR DRAM MODULE
|
DDR DRAM MODULE
|
Memory Width |
64
|
64
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
200
|
200
|
Number of Words |
268435456 words
|
268435456 words
|
Number of Words Code |
256000000
|
256000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
65 °C
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
256MX64
|
256MX64
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
DIMM
|
DIMM
|
Package Equivalence Code |
DIMM200,24
|
DIMM200,24
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Refresh Cycles |
8192
|
8192
|
Seated Height-Max |
3.8 mm
|
30.15 mm
|
Self Refresh |
YES
|
YES
|
Standby Current-Max |
0.16 A
|
0.16 A
|
Supply Current-Max |
2.24 mA
|
1.48 mA
|
Supply Voltage-Max (Vsup) |
1.9 V
|
1.9 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.6 mm
|
0.6 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
30 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare HMP125S6NFR8C-S5 with alternatives
Compare M470T5663FB3-CF7 with alternatives