HMC263
vs
MMZ09312BT1
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITTITE MICROWAVE CORP
|
FREESCALE SEMICONDUCTOR INC
|
| Package Description |
DIE OR CHIP
|
3 X 3 MM, ROHS COMPLIANT, SURFACE MOUNT, PLASTIC, 2131-01, QFN-12
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A001.B.2.D
|
EAR99
|
| Characteristic Impedance |
50 Ω
|
50 Ω
|
| Construction |
COMPONENT
|
COMPONENT
|
| Gain |
17 dB
|
29 dB
|
| Input Power-Max (CW) |
-5 dBm
|
14 dBm
|
| JESD-609 Code |
e4
|
e3
|
| Number of Functions |
1
|
1
|
| Operating Frequency-Max |
36000 MHz
|
1000 MHz
|
| Operating Frequency-Min |
24000 MHz
|
400 MHz
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Equivalence Code |
DIE OR CHIP
|
LCC12,.12SQ,20
|
| Power Supplies |
3 V
|
5 V
|
| RF/Microwave Device Type |
WIDE BAND LOW POWER
|
WIDE BAND MEDIUM POWER
|
| Supply Current-Max |
58 mA
|
83 mA
|
| Technology |
GAAS
|
BIPOLAR
|
| Terminal Finish |
Gold (Au)
|
Matte Tin (Sn)
|
| Base Number Matches |
2
|
2
|
| HTS Code |
|
8542.33.00.01
|
| Samacsys Manufacturer |
|
NXP
|
| Mounting Feature |
|
SURFACE MOUNT
|
| Number of Terminals |
|
12
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Surface Mount |
|
YES
|
|
|
|
Compare HMC263 with alternatives
Compare MMZ09312BT1 with alternatives