HM6708AP-25 vs 5962-8854501LA feature comparison

HM6708AP-25 Renesas Electronics Corporation

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5962-8854501LA Teledyne e2v

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP TELEDYNE E2V (UK) LTD
Part Package Code DIP DIP
Package Description DIP, DIP, DIP24,.3
Pin Count 24 24
Reach Compliance Code compliant compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 35 ns
JESD-30 Code R-PDIP-T24 R-GDIP-T24
Length 29.88 mm 30.48 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX4 64KX4
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Qualified
Seated Height-Max 5.08 mm 3.81 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BICMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 2 5
I/O Type COMMON
JESD-609 Code e0
Output Characteristics 3-STATE
Package Equivalence Code DIP24,.3
Screening Level MIL-STD-883
Standby Current-Max 0.001 A
Standby Voltage-Min 2 V
Supply Current-Max 0.12 mA
Terminal Finish TIN LEAD

Compare HM6708AP-25 with alternatives

Compare 5962-8854501LA with alternatives