HM66AEB36102BP-30
vs
MCM69F817ZP6.5R
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
LBGA, BGA165,11X15,40
|
BGA,
|
Pin Count |
165
|
119
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
3A991.B.2.A
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
0.45 ns
|
|
Clock Frequency-Max (fCLK) |
333 MHz
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PBGA-B165
|
|
Length |
17 mm
|
|
Memory Density |
37748736 bit
|
|
Memory IC Type |
DDR SRAM
|
|
Memory Width |
36
|
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
|
Number of Terminals |
165
|
|
Number of Words |
1048576 words
|
|
Number of Words Code |
1000000
|
|
Operating Mode |
SYNCHRONOUS
|
|
Operating Temperature-Max |
70 °C
|
|
Operating Temperature-Min |
|
|
Organization |
1MX36
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
LBGA
|
|
Package Equivalence Code |
BGA165,11X15,40
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
GRID ARRAY, LOW PROFILE
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.46 mm
|
|
Standby Current-Max |
0.35 A
|
|
Standby Voltage-Min |
1.7 V
|
|
Supply Current-Max |
0.88 mA
|
|
Supply Voltage-Max (Vsup) |
1.9 V
|
|
Supply Voltage-Min (Vsup) |
1.7 V
|
|
Supply Voltage-Nom (Vsup) |
1.8 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
COMMERCIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
15 mm
|
|
Base Number Matches |
1
|
2
|
|
|
|
Compare HM66AEB36102BP-30 with alternatives
Compare MCM69F817ZP6.5R with alternatives