HM65256BLP-10T
vs
U635H256BD1C25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
SIMTEK CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
25 ns
Additional Feature
CE/AUTO/SELF REFRESH
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Length
35.6 mm
37.1 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PSEUDO STATIC RAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Output Enable
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.7 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
3
Pbfree Code
Rohs Code
JESD-609 Code
e0
Package Equivalence Code
DIP28,.6
Peak Reflow Temperature (Cel)
240
Standby Current-Max
0.003 A
Supply Current-Max
0.095 mA
Terminal Finish
TIN LEAD
Compare HM65256BLP-10T with alternatives
Compare U635H256BD1C25 with alternatives