HM65256BLP-10
vs
DPS41257-55B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Contact Manufacturer
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
TWILIGHT TECHNOLOGY INC
Part Package Code
DIP
Package Description
DIP,
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
55 ns
Additional Feature
ACCESS TIME IN STATIC COLUMN MODE =50NS
JESD-30 Code
R-PDIP-T28
R-XDMA-T28
Length
35.6 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PSEUDO STATIC RAM
SRAM MODULE
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.7 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
MOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-STD-883 Class B (Modified)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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