HM65256ASP-20
vs
U631H256CD1C45G1
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code
DIP
DIP
Package Description
DIP,
0.600 INCH, PLASTIC, DIP-28
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
45 ns
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
Length
36 mm
37.1 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PSEUDO STATIC RAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32KX8
32KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
Base Number Matches
2
3
Pbfree Code
Rohs Code
JESD-609 Code
e3
Moisture Sensitivity Level
3
Terminal Finish
MATTE TIN
Compare HM65256ASP-20 with alternatives
Compare U631H256CD1C45G1 with alternatives