HM62W16255HJP-12
vs
WMS256K16L-35FGI
feature comparison
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
WHITE MICROELECTRONICS
|
Part Package Code |
SOJ
|
|
Package Description |
SOJ,
|
CERAMIC, FP-44
|
Pin Count |
44
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
12 ns
|
35 ns
|
Additional Feature |
TTL COMPATIBLE INPUTS/OUTPUTS
|
|
JESD-30 Code |
R-PDSO-J44
|
R-CDSO-G44
|
Length |
28.33 mm
|
|
Memory Density |
4194304 bit
|
4194304 bit
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Number of Words |
262144 words
|
262144 words
|
Number of Words Code |
256000
|
256000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
256KX16
|
256KX16
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
SOJ
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
3.76 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
3 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
10.16 mm
|
|
Base Number Matches |
2
|
3
|
|
|
|
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