HM62V16258BLTT-7
vs
WMS256K16L-20FGCA
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
WHITE MICROELECTRONICS
|
| Part Package Code |
TSOP2
|
|
| Package Description |
TSOP2,
|
CERAMIC, FP-44
|
| Pin Count |
44
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
|
| HTS Code |
8542.32.00.41
|
|
| Access Time-Max |
70 ns
|
20 ns
|
| JESD-30 Code |
R-PDSO-G44
|
R-CDSO-G44
|
| Length |
18.41 mm
|
|
| Memory Density |
4194304 bit
|
4194304 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
44
|
44
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX16
|
256KX16
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
TSOP2
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
10.16 mm
|
|
| Base Number Matches |
2
|
3
|
|
|
|
Compare HM62V16258BLTT-7 with alternatives