HM62V16256CLBP-5
vs
HM62A16256CLBPI-7
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
HITACHI LTD
Part Package Code
BGA
BGA
Package Description
TFBGA, BGA48,6X8,30
TFBGA, BGA48,6X8,30
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
55 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
S-PBGA-B48
S-PBGA-B48
Length
6.5 mm
6.5 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Organization
256KX16
256KX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA48,6X8,30
BGA48,6X8,30
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Standby Voltage-Min
2 V
1 V
Supply Current-Max
0.025 mA
0.025 mA
Supply Voltage-Max (Vsup)
3.6 V
2 V
Supply Voltage-Min (Vsup)
2.2 V
1.65 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6.5 mm
6.5 mm
Base Number Matches
2
2
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
Compare HM62V16256CLBP-5 with alternatives
Compare HM62A16256CLBPI-7 with alternatives