HM627HLP-35
vs
HM6707P-20
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
HITACHI LTD
Part Package Code
DIP
DIP
Package Description
DIP,
DIP, DIP24,.3
Pin Count
24
24
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
35 ns
20 ns
JESD-30 Code
R-PDIP-T24
R-PDIP-T24
Length
29.88 mm
29.88 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX1
256KX1
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
BICMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
I/O Type
SEPARATE
JESD-609 Code
e0
Number of Ports
1
Output Characteristics
3-STATE
Output Enable
NO
Package Equivalence Code
DIP24,.3
Standby Current-Max
0.01 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.12 mA
Terminal Finish
Tin/Lead (Sn/Pb)
Compare HM627HLP-35 with alternatives
Compare HM6707P-20 with alternatives