HM6268P-25 vs P4C168-25FMB feature comparison

HM6268P-25 Hitachi Ltd

Buy Now Datasheet

P4C168-25FMB Pyramid Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer HITACHI LTD PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DFP
Package Description DIP, DIP20,.3 CERAMIC, PACKAGE-20
Pin Count 20 20
Reach Compliance Code unknown compliant
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 25 ns
Additional Feature BATTERY BACKUP
I/O Type COMMON
JESD-30 Code R-PDIP-T20 R-CDFP-F20
JESD-609 Code e0 e0
Length 24.5 mm 13.716 mm
Memory Density 16384 bit 16384 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 20 20
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 4KX4 4KX4
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DFP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLATPACK
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 2.286 mm
Standby Voltage-Min 4.5 V
Supply Current-Max 0.09 mA 0.12 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE FLAT
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 8.382 mm
Base Number Matches 1 1
Pbfree Code No
Screening Level MIL-STD-883 Class B

Compare HM6268P-25 with alternatives

Compare P4C168-25FMB with alternatives