HM6264AFP-15
vs
UT6716455WPA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
AEROFLEX COLORADO SPRINGS
Part Package Code
SOIC
DFP
Package Description
SOP,
0.490 X 0.740 INCH, 0.050 INCH PITCH, FP-28
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
150 ns
55 ns
JESD-30 Code
R-PDSO-G28
R-CDFP-F28
Length
18.3 mm
18.288 mm
Memory Density
65536 bit
65536 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
8192 words
8192 words
Number of Words Code
8000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
Operating Temperature-Min
Organization
8KX8
8KX8
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.921 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
8.4 mm
12.446 mm
Base Number Matches
2
1
Compare HM6264AFP-15 with alternatives
Compare UT6716455WPA with alternatives