HM6208P-45 vs 5962-8868105LX feature comparison

HM6208P-45 Hitachi Ltd

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5962-8868105LX QP Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD QP SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 0.300 INCH, CERAMIC, DIP-24
Pin Count 24 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 3A001.A.2.C
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 45 ns 25 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T24 R-CDIP-T24
JESD-609 Code e0
Length 29.88 mm
Memory Density 262144 bit 262144 bit
Memory IC Type CACHE SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1
Number of Terminals 24 24
Number of Words 65536 words 65536 words
Number of Words Code 64000 64000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 64KX4 64KX4
Output Characteristics 3-STATE
Output Enable NO
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Standby Current-Max 0.002 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.1 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Additional Feature TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
Screening Level MIL-STD-883

Compare HM6208P-45 with alternatives

Compare 5962-8868105LX with alternatives