HM6207HLP-35
vs
MT5C2561C-35IT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
AUSTIN SEMICONDUCTOR INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.3
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.41
Access Time-Max
35 ns
35 ns
Additional Feature
TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP
I/O Type
SEPARATE
JESD-30 Code
R-PDIP-T24
R-CDIP-T24
JESD-609 Code
e0
e0
Length
29.88 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Terminals
24
24
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX1
256KX1
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Standby Current-Max
0.0001 A
Standby Voltage-Min
2 V
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
2
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HM6207HLP-35 with alternatives
Compare MT5C2561C-35IT with alternatives