HM6167P-8
vs
HM4-65767BNDB:RD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
MATRA MHS
Part Package Code
DIP
Package Description
DIP, DIP20,.3
,
Pin Count
20
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
50 ns
I/O Type
SEPARATE
JESD-30 Code
R-PDIP-T20
R-CQCC-N20
JESD-609 Code
e0
Length
25.4 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
20
20
Number of Words
16384 words
16384 words
Number of Words Code
16000
16000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
16KX1
16KX1
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
NO
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
QCCN
Package Equivalence Code
DIP20,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
CHIP CARRIER
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Supply Current-Max
0.06 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
QUAD
Width
7.62 mm
Base Number Matches
1
1
Screening Level
MIL-STD-883 Class B
Compare HM6167P-8 with alternatives
Compare HM4-65767BNDB:RD with alternatives