HM6116ASP-12
vs
U635H16BDK35
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.3
DIP, DIP24,.6
Pin Count
24
24
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
120 ns
35 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e0
Length
30.4 mm
31.95 mm
Memory Density
16384 bit
16384 bit
Memory IC Type
STANDARD SRAM
NON-VOLATILE SRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
24
24
Number of Words
2048 words
2048 words
Number of Words Code
2000
2000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2KX8
2KX8
Output Characteristics
3-STATE
3-STATE
Output Enable
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.1 mm
Standby Current-Max
0.002 A
0.003 A
Standby Voltage-Min
4.5 V
Supply Current-Max
0.06 mA
0.085 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
15.24 mm
Base Number Matches
1
2
Pbfree Code
Moisture Sensitivity Level
3
Compare HM6116ASP-12 with alternatives
Compare U635H16BDK35 with alternatives