HM6-6641-9
vs
HM1-7647R5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HARRIS SEMICONDUCTOR
HARRIS SEMICONDUCTOR
Package Description
DIP, DIP24,.3
DIP, DIP24,.6
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
JESD-30 Code
R-XDIP-T24
R-XDIP-T24
JESD-609 Code
e0
e0
Memory Density
4096 bit
4096 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
8
Number of Terminals
24
24
Number of Words
512 words
512 words
Number of Words Code
512
512
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
512X8
512X8
Package Body Material
CERAMIC
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.3
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
2
Access Time-Max
60 ns
Supply Voltage-Nom (Vsup)
5 V
Compare HM6-6641-9 with alternatives
Compare HM1-7647R5 with alternatives