HM5225165BTT-75
vs
MT48LC32M8A2P-6AL
feature comparison
| Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
| Ihs Manufacturer |
HITACHI CHEMICAL CO AMERICA LTD
|
MICRON TECHNOLOGY INC
|
| Package Description |
,
|
TSOP, TSOP54,.46,32
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
|
| Base Number Matches |
3
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Access Time-Max |
|
5.4 ns
|
| Clock Frequency-Max (fCLK) |
|
167 MHz
|
| I/O Type |
|
COMMON
|
| Interleaved Burst Length |
|
1,2,4,8
|
| JESD-30 Code |
|
R-PDSO-G54
|
| JESD-609 Code |
|
e3
|
| Memory Density |
|
268435456 bit
|
| Memory IC Type |
|
SYNCHRONOUS DRAM
|
| Memory Width |
|
8
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
54
|
| Number of Words |
|
33554432 words
|
| Number of Words Code |
|
32000000
|
| Operating Temperature-Max |
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
|
32MX8
|
| Output Characteristics |
|
3-STATE
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP
|
| Package Equivalence Code |
|
TSOP54,.46,32
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power Supplies |
|
3.3 V
|
| Qualification Status |
|
Not Qualified
|
| Refresh Cycles |
|
8192
|
| Sequential Burst Length |
|
1,2,4,8,FP
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
COMMERCIAL
|
| Terminal Finish |
|
MATTE TIN
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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