HM465798K-9:RD
vs
5962-9318714H4A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
TEMIC SEMICONDUCTORS
MICROSS COMPONENTS
Reach Compliance Code
unknown
compliant
Access Time-Max
35 ns
35 ns
JESD-30 Code
R-CQCC-N28
S-XPGA-P66
Memory Density
262144 bit
4194304 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
32
Number of Functions
1
1
Number of Ports
1
Number of Terminals
28
66
Number of Words
65536 words
131072 words
Number of Words Code
64000
128000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
64KX4
128KX32
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, METAL-SEALED COFIRED
UNSPECIFIED
Package Code
QCCN
PGA
Package Shape
RECTANGULAR
SQUARE
Package Style
CHIP CARRIER
GRID ARRAY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
NO LEAD
PIN/PEG
Terminal Position
QUAD
PERPENDICULAR
Base Number Matches
2
7
Part Package Code
PGA
Package Description
PGA, PGA66,11X11
Pin Count
66
ECCN Code
3A001.A.2.C
HTS Code
8542.32.00.41
I/O Type
COMMON
JESD-609 Code
e0
Length
27.3 mm
Package Equivalence Code
PGA66,11X11
Screening Level
MIL-PRF-38534 Class H
Seated Height-Max
4.95 mm
Standby Current-Max
0.005 A
Standby Voltage-Min
2 V
Supply Current-Max
0.52 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Terminal Pitch
2.54 mm
Width
27.3 mm
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