HM4-65767BNDB:RD
vs
AM100470ADCB
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ATMEL CORP
|
ADVANCED MICRO DEVICES INC
|
Package Description |
,
|
DIP, DIP18,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Base Number Matches |
2
|
1
|
Pbfree Code |
|
No
|
Rohs Code |
|
No
|
Part Package Code |
|
DIP
|
Pin Count |
|
18
|
Access Time-Max |
|
25 ns
|
I/O Type |
|
SEPARATE
|
JESD-30 Code |
|
R-GDIP-T18
|
JESD-609 Code |
|
e0
|
Length |
|
22.86 mm
|
Memory Density |
|
4096 bit
|
Memory Width |
|
1
|
Number of Functions |
|
1
|
Number of Ports |
|
1
|
Number of Terminals |
|
18
|
Number of Words |
|
4096 words
|
Number of Words Code |
|
4000
|
Operating Mode |
|
ASYNCHRONOUS
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
|
Organization |
|
4KX1
|
Output Characteristics |
|
OPEN-EMITTER
|
Output Enable |
|
NO
|
Package Body Material |
|
CERAMIC, GLASS-SEALED
|
Package Code |
|
DIP
|
Package Equivalence Code |
|
DIP18,.3
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Parallel/Serial |
|
PARALLEL
|
Seated Height-Max |
|
5.08 mm
|
Supply Current-Max |
|
0.2 mA
|
Surface Mount |
|
NO
|
Technology |
|
ECL
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
TIN LEAD
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
2.54 mm
|
Terminal Position |
|
DUAL
|
Width |
|
7.62 mm
|
|
|
|
Compare HM4-65767BNDB:RD with alternatives
Compare AM100470ADCB with alternatives