HM4-6504S-9
vs
AM91L14E/BVA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
ADVANCED MICRO DEVICES INC
Package Description
QCCN, LCC18,.3X.35
DIP, DIP18,.3
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
120 ns
200 ns
I/O Type
SEPARATE
COMMON
JESD-30 Code
R-XQCC-N18
R-GDIP-T18
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
4
Number of Terminals
18
18
Number of Words
4096 words
1024 words
Number of Words Code
4000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Organization
4KX1
1KX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC
CERAMIC, GLASS-SEALED
Package Code
QCCN
DIP
Package Equivalence Code
LCC18,.3X.35
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Standby Current-Max
0.000015 A
Standby Voltage-Min
2 V
Supply Current-Max
0.031 mA
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
NMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
18
JESD-609 Code
e0
Length
22.86 mm
Number of Functions
1
Number of Ports
1
Output Enable
NO
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Terminal Finish
TIN LEAD
Width
7.62 mm
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