HM3-7640A5
vs
HM6-7640-5
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
Package Description |
DIP, DIP24,.6
|
DIP, DIP24,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Access Time-Max |
50 ns
|
70 ns
|
JESD-30 Code |
R-PDIP-T24
|
R-XDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Memory Density |
4096 bit
|
4096 bit
|
Memory IC Type |
OTP ROM
|
OTP ROM
|
Memory Width |
8
|
8
|
Number of Terminals |
24
|
24
|
Number of Words |
512 words
|
512 words
|
Number of Words Code |
512
|
512
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Organization |
512X8
|
512X8
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP24,.6
|
DIP24,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
0.17 mA
|
0.17 mA
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
TTL
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
|
|
|
Compare HM3-7640A5 with alternatives
Compare HM6-7640-5 with alternatives