HM3-6514C9
vs
P2114L
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
DIP, DIP18,.3
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.41
|
8542.32.00.41
|
Access Time-Max |
320 ns
|
|
I/O Type |
COMMON
|
|
JESD-30 Code |
R-PDIP-T18
|
|
JESD-609 Code |
e0
|
|
Memory Density |
4096 bit
|
|
Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
Memory Width |
4
|
|
Number of Terminals |
18
|
|
Number of Words |
1024 words
|
|
Number of Words Code |
1000
|
|
Operating Mode |
ASYNCHRONOUS
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1KX4
|
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
DIP
|
|
Package Equivalence Code |
DIP18,.3
|
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Parallel/Serial |
PARALLEL
|
|
Qualification Status |
Not Qualified
|
|
Standby Current-Max |
0.00005 A
|
|
Standby Voltage-Min |
2 V
|
|
Supply Current-Max |
0.014 mA
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
NO
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
|
Base Number Matches |
1
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HM3-6514C9 with alternatives
Compare P2114L with alternatives