HM10474-8
vs
CY8C150-25DMB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
HITACHI LTD
CYPRESS SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
DIP, DIP24,.4
Pin Count
24
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
8 ns
25 ns
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-GDIP-T24
R-XDIP-T24
JESD-609 Code
e0
e0
Length
30.3 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
Number of Ports
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
1KX4
1KX4
Output Characteristics
OPEN-EMITTER
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.4
DIP24,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.8 mm
Supply Current-Max
0.24 mA
Surface Mount
NO
NO
Technology
ECL
CMOS
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
Base Number Matches
1
1
Screening Level
38535Q/M;38534H;883B
Supply Voltage-Nom (Vsup)
5 V
Compare HM10474-8 with alternatives
Compare CY8C150-25DMB with alternatives