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HM1-7611-2 vs HM1-7611B5 feature comparison

HM1-7611-2 Harris Semiconductor

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HM1-7611B5 Harris Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR HARRIS SEMICONDUCTOR
Package Description DIP, DIP16,.3 DIP, DIP16,.3
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 75 ns 35 ns
JESD-30 Code R-XDIP-T16 R-XDIP-T16
JESD-609 Code e0 e0
Memory Density 1024 bit 1024 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 4 4
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 256X4 256X4
Package Body Material CERAMIC CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP16,.3 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Current-Max 0.13 mA 0.13 mA
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Memory » OTP ROMs
Memory » OTP ROMs

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