HM1-65797M-9:D
vs
5962-8872502XC
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MATRA MHS
|
MICROSS COMPONENTS
|
| Package Description |
,
|
QCCN,
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
45 ns
|
45 ns
|
| JESD-30 Code |
R-GDIP-T24
|
R-CQCC-N28
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
|
| Number of Terminals |
24
|
28
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
256KX1
|
256KX1
|
| Output Characteristics |
3-STATE
|
|
| Output Enable |
NO
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Parallel/Serial |
PARALLEL
|
SERIAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
28
|
| JESD-609 Code |
|
e4
|
| Length |
|
13.97 mm
|
| Seated Height-Max |
|
2.03 mm
|
| Terminal Finish |
|
GOLD
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
8.89 mm
|
|
|
|
Compare HM1-65797M-9:D with alternatives
Compare 5962-8872502XC with alternatives