HK160818NJ-T
vs
CIN-0603-H22DJB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TAIYO YUDEN CO LTD
|
API TECHNOLOGIES CORP
|
| Package Description |
CHIP
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8504.50.80.00
|
8504.50.80.00
|
| Samacsys Manufacturer |
TAIYO YUDEN
|
|
| Case/Size Code |
0603
|
|
| Construction |
Multilayer Chip
|
|
| Core Material |
FERRITE
|
CERAMIC
|
| DC Resistance |
0.35 Ω
|
0.4 Ω
|
| Inductance-Nom (L) |
0.018 µH
|
0.022 µH
|
| Inductor Application |
RF INDUCTOR
|
RF INDUCTOR
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Height |
0.8 mm
|
|
| Package Length |
1.6 mm
|
|
| Package Style |
SMT
|
|
| Package Width |
0.8 mm
|
|
| Packing Method |
TR, PAPER, 7 INCH
|
|
| Quality Factor-Min (at L-nom) |
12
|
|
| Rated Current-Max |
0.3 A
|
0.3 A
|
| Self Resonance Frequency |
2000 MHz
|
1850 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
| Shielded |
NO
|
NO
|
| Special Feature |
MULTI LAYER
|
|
| Surface Mount |
YES
|
YES
|
| Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
| Terminal Shape |
WRAPAROUND
|
WRAPAROUND
|
| Test Frequency |
100 MHz
|
|
| Tolerance |
5%
|
5%
|
| Base Number Matches |
2
|
1
|
| JESD-609 Code |
|
e0
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare CIN-0603-H22DJB with alternatives