HIP2103FRTAAZ
vs
HIP2103FRTAAZ-T13
feature comparison
| Pbfree Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
TDFN
|
|
| Pin Count |
8
|
|
| Manufacturer Package Code |
L8.3X3A
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
26 Weeks, 1 Day
|
|
| Date Of Intro |
2017-10-27
|
2017-10-27
|
| Samacsys Manufacturer |
Renesas Electronics
|
|
| High Side Driver |
YES
|
|
| Interface IC Type |
HALF BRIDGE BASED MOSFET DRIVER
|
HALF BRIDGE BASED MOSFET DRIVER
|
| JESD-30 Code |
S-PDSO-N8
|
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Peak Current Limit-Nom |
1 A
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVSON
|
|
| Package Equivalence Code |
SOLCC8,.12,25
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.8 mm
|
|
| Supply Current-Max |
1.04 mA
|
|
| Supply Voltage1-Max |
14 V
|
|
| Supply Voltage1-Min |
4.5 V
|
|
| Supply Voltage1-Nom |
12 V
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Turn-off Time |
0.046 µs
|
|
| Turn-on Time |
0.04 µs
|
|
| Width |
3 mm
|
|
| Base Number Matches |
5
|
1
|
| Rohs Code |
|
Yes
|
| Package Description |
|
,
|
|
|
|