HIP1011ACBZA
vs
TPS2120YFPR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOIC-16
|
VFBGA,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Adjustable Threshold |
YES
|
YES
|
| Analog IC - Other Type |
POWER SUPPLY SUPPORT CIRCUIT
|
POWER SUPPLY SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDSO-G16
|
R-XBGA-B20
|
| JESD-609 Code |
e3
|
e1
|
| Length |
9.9 mm
|
1.918 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Channels |
4
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
20
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
SOP
|
VFBGA
|
| Package Equivalence Code |
SOP16,.25
|
BGA20,4X5,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
13.2 V
|
22 V
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
2.8 V
|
| Supply Voltage-Nom (Vsup) |
12 V
|
12 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
TIN SILVER COPPER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
1.27 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3.9 mm
|
1.518 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
Yes
|
| Date Of Intro |
|
2018-09-09
|
| Samacsys Manufacturer |
|
Texas Instruments
|
|
|
|
Compare HIP1011ACBZA with alternatives
Compare TPS2120YFPR with alternatives