HI9P0508-5
vs
HI3-0549-9
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
SOIC
Package Description
PLASTIC, MS-012-AC, SOIC-16
DIP-16
Pin Count
16
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
Moisture Sensitivity Level
1
Neg Supply Voltage-Min (Vsup)
-10 V
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
8
4
Number of Functions
1
1
Number of Terminals
16
16
Off-state Isolation-Nom
68 dB
68 dB
On-state Resistance Match-Nom
9 Ω
126 Ω
On-state Resistance-Max (Ron)
400 Ω
1800 Ω
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Equivalence Code
SOP16,.25
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Peak Reflow Temperature (Cel)
240
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Signal Current-Max
0.02 A
0.02 A
Supply Current-Max (Isup)
2.4 mA
2 mA
Supply Voltage-Min (Vsup)
10 V
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
YES
NO
Switch-off Time-Max
1000 ns
1000 ns
Switch-on Time-Max
1000 ns
1000 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL EXTENDED
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
3
3
Additional Feature
OVERVOLTAGE PROTECTION
Compare HI9P0508-5 with alternatives
Compare HI3-0549-9 with alternatives