HI9P0305-5
vs
SW06BRC
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTERSIL CORP
|
ANALOG DEVICES INC
|
| Package Description |
SOP, SOP14,.25
|
LCC-20
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G14
|
S-CQCC-N20
|
| JESD-609 Code |
e0
|
e0
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
14
|
20
|
| On-state Resistance-Max (Ron) |
75 Ω
|
80 Ω
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
SOP
|
QCCN
|
| Package Equivalence Code |
SOP14,.25
|
LCC20,.35SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
YES
|
YES
|
| Switch-on Time-Max |
250 ns
|
500 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
BIMOS
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QLCC
|
| Pin Count |
|
20
|
| Analog IC - Other Type |
|
SPST
|
| Length |
|
8.89 mm
|
| Normal Position |
|
NO/NC
|
| Number of Channels |
|
1
|
| Off-state Isolation-Nom |
|
58 dB
|
| On-state Resistance Match-Nom |
|
5 Ω
|
| Output |
|
SEPARATE OUTPUT
|
| Seated Height-Max |
|
2.54 mm
|
| Switch-off Time-Max |
|
400 ns
|
| Width |
|
8.89 mm
|
|
|
|
Compare HI9P0305-5 with alternatives
Compare SW06BRC with alternatives