HI5813JIP
vs
HI5813JIB
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
INTERSIL CORP
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
DIP
|
SOIC
|
| Package Description |
PLASTIC, DIP-24
|
SOP,
|
| Pin Count |
24
|
24
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog Input Voltage-Max |
3.3 V
|
6.8 V
|
| Conversion Time-Max |
25 µs
|
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G24
|
| JESD-609 Code |
e0
|
e0
|
| Length |
31 mm
|
|
| Linearity Error-Max (EL) |
0.0977%
|
0.096%
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP24,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Sample Rate |
0.04 MHz
|
0.04 MHz
|
| Sample and Hold / Track and Hold |
TRACK
|
|
| Seated Height-Max |
6.35 mm
|
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
No
|
| Analog Input Voltage-Min |
|
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HI5813JIP with alternatives