HI5760IA
vs
AD9760AR50
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ROCHESTER ELECTRONICS LLC
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Analog Output Voltage-Max |
1.25 V
|
1.25 V
|
| Analog Output Voltage-Min |
-0.3 V
|
-1 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDSO-G28
|
| Length |
9.7 mm
|
17.9 mm
|
| Linearity Error-Max (EL) |
0.09765625%
|
0.0977%
|
| Number of Bits |
10
|
10
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SOP
|
| Package Equivalence Code |
TSSOP28,.25
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Seated Height-Max |
1.2 mm
|
2.65 mm
|
| Settling Time-Nom (tstl) |
0.035 µs
|
0.035 µs
|
| Supply Current-Max |
30 mA
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
7.5 mm
|
| Base Number Matches |
4
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Package Description |
|
0.300 INCH, SOIC-28
|
| Pin Count |
|
28
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
240
|
| Qualification Status |
|
COMMERCIAL
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|