HI3-303-5
vs
HI3-0303-5
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
Package Description |
DIP, DIP14,.3
|
DIP-14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-PDIP-T14
|
R-PDIP-T14
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Off-state Isolation-Nom |
60 dB
|
60 dB
|
On-state Resistance-Max (Ron) |
50 Ω
|
50 Ω
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-off Time-Max |
250 ns
|
250 ns
|
Switch-on Time-Max |
300 ns
|
300 ns
|
Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
3
|
|
|
|
Compare HI3-303-5 with alternatives