HI3-0547-9
vs
MAX337EWI+
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
HARRIS SEMICONDUCTOR
MAXIM INTEGRATED PRODUCTS INC
Package Description
DIP, DIP28,.6
0.300 INCH, SOIC-28
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
OVERVOLTAGE PROTECTION
Analog IC - Other Type
DIFFERENTIAL MULTIPLEXER
DIFFERENTIAL MULTIPLEXER
JESD-30 Code
R-PDIP-T28
R-PDSO-G28
JESD-609 Code
e0
e3
Neg Supply Voltage-Nom (Vsup)
-15 V
-15 V
Number of Channels
8
8
Number of Functions
1
1
Number of Terminals
28
28
Off-state Isolation-Nom
68 dB
82 dB
On-state Resistance Match-Nom
126 Ω
5 Ω
On-state Resistance-Max (Ron)
1800 Ω
400 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
SOP
Package Equivalence Code
DIP28,.6
SOP28,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Qualification Status
Not Qualified
Not Qualified
Signal Current-Max
0.02 A
0.03 A
Supply Current-Max (Isup)
2 mA
1.11 mA
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
YES
Switch-off Time-Max
1000 ns
500 ns
Switch-on Time-Max
1000 ns
500 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Pbfree Code
Yes
Part Package Code
SOIC
Pin Count
28
ECCN Code
EAR99
Length
17.9 mm
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
260
Seated Height-Max
2.65 mm
Time@Peak Reflow Temperature-Max (s)
30
Width
7.5 mm
Compare HI3-0547-9 with alternatives
Compare MAX337EWI+ with alternatives