HI1-574AUD-2 vs HI4-574ASE/883 feature comparison

HI1-574AUD-2 Rochester Electronics LLC

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HI4-574ASE/883 Intersil Corporation

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Contact Manufacturer Obsolete
ROCHESTER ELECTRONICS LLC INTERSIL CORP
DIP, CERAMIC, LCC-44
unknown not_compliant
3A001.A.2.C 3A001.A.2.C
8542.39.00.01 8542.39.00.01
10 V 10 V
-10 V -10 V
25 µs 25 µs
ADC, SUCCESSIVE APPROXIMATION ADC, SUCCESSIVE APPROXIMATION
R-CDIP-T28 S-CQCC-N44
0.0244% 0.0244%
-12 V -12 V
1 1
12 12
1 1
28 44
125 °C 125 °C
-55 °C -55 °C
BINARY BINARY
PARALLEL, WORD PARALLEL, WORD
CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
DIP QCCN
RECTANGULAR SQUARE
IN-LINE CHIP CARRIER
SAMPLE SAMPLE
12 V 12 V
NO YES
MILITARY MILITARY
THROUGH-HOLE NO LEAD
DUAL QUAD
3 3
No
LCC
44
e0
16.535 mm
LCC44,.65SQ
Not Qualified
MIL-STD-883
3.5 mm
BICMOS
TIN LEAD
1.27 mm
16.535 mm

Compare HI1-574AUD-2 with alternatives

Compare HI4-574ASE/883 with alternatives