HI1-574AUD/883
vs
HI1-574ATD-2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
INTERSIL CORP
HARRIS SEMICONDUCTOR
Part Package Code
DIP
Package Description
CERAMIC, SIDEBRAZED, DIP-28
DIP, DIP28,.6
Pin Count
28
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Analog Input Voltage-Max
10 V
24 V
Analog Input Voltage-Min
-10 V
-24 V
Conversion Time-Max
25 µs
25 µs
Converter Type
ADC, SUCCESSIVE APPROXIMATION
ADC, SUCCESSIVE APPROXIMATION
JESD-30 Code
R-CDIP-T28
R-CDIP-T28
JESD-609 Code
e0
e0
Linearity Error-Max (EL)
0.0122%
0.012%
Negative Supply Voltage-Nom
-12 V
Number of Analog In Channels
1
1
Number of Bits
12
12
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Bit Code
BINARY
BINARY, OFFSET BINARY
Output Format
PARALLEL, WORD
PARALLEL, WORD
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Sample and Hold / Track and Hold
SAMPLE
Screening Level
MIL-STD-883
Seated Height-Max
5.92 mm
Supply Voltage-Nom
12 V
Surface Mount
NO
NO
Technology
BICMOS
BIPOLAR
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
3
4
Sample Rate
0.05 MHz
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