HI1-5051-2
vs
DG212BDQ
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
SILICONIX INC
|
| Package Description |
DIP, DIP16,.3
|
TSSOP, TSSOP16,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPST
|
| JESD-30 Code |
R-GDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
e0
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
|
| Number of Channels |
1
|
|
| Number of Functions |
2
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
80 dB
|
|
| On-state Resistance Match-Nom |
1 Ω
|
|
| On-state Resistance-Max (Ron) |
45 Ω
|
200 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
TSSOP
|
| Package Equivalence Code |
DIP16,.3
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom (Vsup) |
15 V
|
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
500 ns
|
|
| Switch-on Time-Max |
500 ns
|
300 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
5
|
2
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
16
|
| Normal Position |
|
NO
|
|
|
|
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