HI1-306-7
vs
DG306BDJ-E3
feature comparison
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
VISHAY SILICONIX
|
Package Description |
,
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
DPST
|
DPST
|
JESD-30 Code |
R-GDIP-T14
|
R-PDIP-T14
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
2
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Off-state Isolation-Nom |
60 dB
|
62 dB
|
On-state Resistance-Max (Ron) |
50 Ω
|
50 Ω
|
Operating Temperature-Max |
75 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-off Time-Max |
150 ns
|
|
Switch-on Time-Max |
250 ns
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
Samacsys Manufacturer |
|
Vishay
|
JESD-609 Code |
|
e3
|
Length |
|
18.285 mm
|
Moisture Sensitivity Level |
|
1
|
Normal Position |
|
NO
|
Output |
|
SEPARATE OUTPUT
|
Package Equivalence Code |
|
DIP14,.3
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
5.08 mm
|
Switching |
|
BREAK-BEFORE-MAKE
|
Terminal Finish |
|
MATTE TIN
|
Terminal Pitch |
|
2.54 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
Width |
|
7.62 mm
|
|
|
|
Compare HI1-306-7 with alternatives
Compare DG306BDJ-E3 with alternatives