HI1-306-2 vs HI1-0307-2 feature comparison

HI1-306-2 Harris Semiconductor

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HI1-0307-2 Intersil Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer HARRIS SEMICONDUCTOR INTERSIL CORP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type DPST SPDT
JESD-30 Code R-GDIP-T14 R-XDIP-T14
JESD-609 Code e0 e0
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Normal Position NO
Number of Channels 2
Number of Functions 2 2
Number of Terminals 14 14
Off-state Isolation-Nom 60 dB
On-state Resistance-Max (Ron) 50 Ω 75 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material CERAMIC, GLASS-SEALED CERAMIC
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Switch-off Time-Max 150 ns
Switch-on Time-Max 250 ns 250 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 3 4

Compare HI1-306-2 with alternatives

Compare HI1-0307-2 with alternatives